BSM120C12P2C201
1200V, 134A, Chopper, Silicon-carbide (SiC) Power Module

This product is a chopper module consisting of SiC-DMOSFET and SiC-SBD from ROHM.

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Data Sheet 구입 *
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Product Detail

 
형명 | BSM120C12P2C201
상태 | 추천품
패키지 | C
포장 수량 | 12
최소 포장 단위 | 12
포장 사양 | Corrugated Cardboard
RoHS | Yes

사양 :

Drain-source Voltage[V]

1200

Drain Current[A]

134.0

Total Power Dissipation[W]

935

Junction Temperature(Max.)[°C]

175

Storage Temperature (Min.)[°C]

-40

Storage Temperature (Max.)[°C]

125

Package

Chopper

특징 :

  • Low surge, low switching loss.
  • High-speed switching possible.
  • Reduced temperature dependance.

Evaluation
Board

 
    • Drive Board
    • AgileSwitch 2ASC-12A1HP / EDCA2

    • BSM series (1200V, C type)
      Core Driver : 2ASC-12A1HP
      Adapter Board : EDCA2

  • Detail
    • Drive Board
    • BSMGD3C12D24-EVK001

    • This evaluation board, BSMGD3C12D24-EVK001, is a gate driver board for full SiC Modules in C type housing. This evaluation board contains all the necessary components for optimal and safety driving the SiC module.

  • User's Guide Purchase Inquiry
    • Drive Board
    • TAMURA 2DU series

    • For BSM series (1200V, C / E / G type)

  • Detail
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Design Resources

 

Documents

White Paper

  • SiC 파워 디바이스와 구동 IC의 일괄 검증이 가능한 업계 최첨단 Web 시뮬레이션 툴 「ROHM Solution Simulator」

User's Guide

  • Evaluation Board User's Guide for C-type Full SiC Module (BSMGD3C12D24-EVK001)

Technical Articles

Schematic Design & Verification

  • [NEW]SiC 파워 디바이스 · 모듈 어플리케이션 노트
  • 스위칭 회로의 전력 손실 계산
  • Method for Monitoring Switching Waveform
  • 파워 측정 시, 프로브 교정의 중요성 : Deskew 편
  • 바이패스 콘덴서의 임피던스 특성

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • 열 모델이란 (SiC 파워 디바이스)
  • 열 모델의 사용 방법 (SiC 파워 디바이스)
  • Optimized heat sink assembly method for effective heat dissipation
  • 열 저항 RthJC 의 측정 방법과 사용법
  • 열전대를 통한 패키지 이면 온도 측정 시의 주의점

Tools

Simulations (Login Required)

  • AC-DC PFC
    Circuit Number A003: BCM Diode-Bridge-Less VIN=200V IIN=50A
  • AC-DC PFC
    Circuit Number A008: CCM Diode-Bridge-Less Synchro VIN=200V IIN=50A
  • AC-DC PFC
    Circuit Number A010: CCM Totem-Pole Synchro VIN=200V IIN=100A
  • AC-DC PFC
    Circuit Number A017: DCM Diode-Bridge-Less Synchro VIN=200V IIN=50A
  • DC-AC Inverter
    Circuit Number B001: IH Half-Bridge Inverter Po=10kW
  • DC-AC Inverter
    Circuit Number B003: Half-Bridge Inverter Vo=200V Io=100A
  • DC-AC Inverter
    Circuit Number B004: Full-Bridge Inverter Vo=200V Io=100A
  • DC-AC Inverter
    Circuit Number B005: 1-Phase 3-Wire Inverter Vo=100/200V Po=20kW
  • DC-DC Converter
    Circuit Number C001: Bi-Directional Converter VH=350V VL=50V IL=200A
  • DC-DC Converter
    Circuit Number C002: Boost Converter Vo=800V Io=20A
  • DC-DC Converter
    Circuit Number C003: Boost Converter 2-Phase Vo=800V Io=40A
  • DC-DC Converter
    Circuit Number C004: Boost Synchro Converter Vo=800V Io=20A
  • DC-DC Converter
    Circuit Number C008: Buck Synchro Converter Vo=250V Io=100A
  • DC-DC Converter
    Circuit Number C009: Buck Synchro Converter 2-Phase Vo=250V Io=200A
  • DC-DC Converter
    Circuit Number C015: Step-Up/Down Converter Vo=400V Io=40A
  • Method for Exporting Circuit Data (ROHM Solution Simulator)
  • ROHM Solution Simulator Power Device Use's Guide for PFC Circuits

Models

  • BSM120C12P2C201 PLECS Model
  • BSM120C12P2C201 SPICE Simulation Evaluation Circuit
  • BSM120C12P2C201 Thermal Model (lib)
  • BSM120C12P2C201 SPICE Model
  • Power Module Loss Simulator - 3Phase Inverter
  • Power Module Loss Simulator - Boost Converter
  • Power Module Loss Simulator - Buck Converter

Packaging & Quality

Package Information

  • Taping Information

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Compliance of the ELV directive
  • Report of SVHC under REACH Regulation

Export Information

  • About Export Regulations