ROHM Product Detail

신규 설계 비추천 BSM600D12P3G001
1200V, 576A, Half-bridge Trench MOS 내장 Full SiC 파워 모듈

기존 고객을 서포트하기 위해 생산하는 제품입니다. 신규 설계용으로는 판매하지 않습니다.

Product Detail

 
형명 | BSM600D12P3G001
패키지 | G Type
포장 사양 | Corrugated Cardboard
포장 수량 | 4
최소 포장 단위 | 4
RoHS | Yes

사양 :

Drain-source Voltage[V]

1200

Drain Current[A]

576

Total Power Dissipation[W]

2450

Junction Temperature (Max.) [℃]

175

Storage Temperature (Min.) [℃]

-40

Storage Temperature (Max.) [℃]

125

Package

Half-bridge

Package Size [mm]

152.0x62.0 (t=18.0)

특징 :

  • Low surge, low switching loss.
  • High-speed switching possible.
  • Reduced temperature dependance.

레퍼런스 디자인 / 어플리케이션 평가 Kit

 
    • Drive Board - BSMGD3G12D24-EVK001
    • This evaluation board, BSMGD3G12D24-EVK001, is a gate driver board for full SiC Modules with the 3rd / 4th Generation SiC-MOSFET in G and E type housing. This evaluation board contains all the necessary components for optimal and safety driving the SiC module.

  • User's Guide
    • Snubber Module - MGSM1D72J2-145MH16
    • Snubber Module for BSM series (1200V, E / G type)

    • Drive Board - TAMURA 2DU series
    • Drive Board for BSM series (1200V, C / E / G type)

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