White Paper
- SiC 파워 디바이스와 구동 IC의 일괄 검증이 가능한 업계 최첨단 Web 시뮬레이션 툴 「ROHM Solution Simulator」
User's Guide
- Evaluation Board User's Guide for C-type Full SiC Module (BSMGD3C12D24-EVK001)
BSM180D12P3C007
BSM180D12P3C007
SiC 파워 모듈
로옴의 SiC-UMOSFET를 사용한 Half bridge 구성의 SiC MOSFET 모듈입니다.
Product Detail
사양 :
Drain-source Voltage[V]
1200
Drain Current[A]
180.0
Total Power Dissipation[W]
880
Junction Temperature(Max.)[°C]
175
Storage Temperature (Min.)[°C]
-40
Storage Temperature (Max.)[°C]
125
Package
Half bridge
특징 :
- Low surge, low switching loss.
- High-speed switching possible.
- Reduced temperature dependance.
Evaluation
Board
-
- Drive Board
- AgileSwitch 2ASC-12A1HP / EDCA2
BSM series (1200V, C type)
Core Driver : 2ASC-12A1HP
Adapter Board : EDCA2
-
- Drive Board
- BSMGD3C12D24-EVK001
This evaluation board, BSMGD3C12D24-EVK001, is a gate driver board for full SiC Modules in C type housing. This evaluation board contains all the necessary components for optimal and safety driving the SiC module.
-
- Snubber Module
- EVSM1D72J2-145MH26
BSM series (1200V, C type)
-
- Drive Board
- TAMURA 2DU series
For BSM series (1200V, C / E / G type)
Design Resources
Documents
White Paper
- SiC 파워 디바이스와 구동 IC의 일괄 검증이 가능한 업계 최첨단 Web 시뮬레이션 툴 「ROHM Solution Simulator」
User's Guide
- Evaluation Board User's Guide for C-type Full SiC Module (BSMGD3C12D24-EVK001)
Technical Articles
Schematic Design & Verification
- [NEW]SiC 파워 디바이스 · 모듈 어플리케이션 노트
- 스위칭 회로의 전력 손실 계산
- Method for Monitoring Switching Waveform
- 파워 측정 시, 프로브 교정의 중요성 : Deskew 편
- 바이패스 콘덴서의 임피던스 특성
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- 열 모델이란 (SiC 파워 디바이스)
- 열 모델의 사용 방법 (SiC 파워 디바이스)
- Optimized heat sink assembly method for effective heat dissipation
- 열 저항 RthJC 의 측정 방법과 사용법
- 열전대를 통한 패키지 이면 온도 측정 시의 주의점
Tools
Simulations (Login Required)
- Method for Exporting Circuit Data (ROHM Solution Simulator)
Models
- BSM180D12P3C007 PLECS Model
- BSM180D12P3C007 SPICE Simulation Evaluation Circuit
- BSM180D12P3C007 SPICE Model
- BSM180D12P3C007 Thermal Model (lib)
- Power Module Loss Simulator - 3Phase Inverter
- Power Module Loss Simulator - Boost Converter
- Power Module Loss Simulator - Buck Converter
Characteristics Data
- ESD Data
Packaging & Quality
Package Information
- Inner Structure
- Taping Information
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- Compliance of the ELV directive
- Report of SVHC under REACH Regulation
Export Information
- About Export Regulations