제조 중지
BD7185AGWL
휴대전화용 파워 매니지먼트 LSI
BD7185AGWL
Product Detail
형명 | BD7185AGWL-E2
상태 |
제조 중지
패키지 |
UCSP50L3C
포장 사양 | Taping
포장 수량 | 2500
최소 포장 단위 | 2500
RoHS |
Yes
사양 :
ch
5
Vin1(Min.)[V]
2.6
Vin1(Max.)[V]
5.5
Serial I/F
I2C
Operating Temperature (Min.)[°C]
-35
Operating Temperature (Max.)[°C]
85
Package Size [mm]
3.8x3.8 (t=0.57)
특징 :
- 5-channel high-efficiency Buck Converters
(16-step adjustable VO by I²C) - 12-channel CMOS-type LDO
(16-step adjustable VO by I²C) - LDO and Buck Converter power ON/OFF control by
I²C interface or external pin. - Power ON/OFF sequence.
- 32.768kHz OSC and output buffer.
- 4-to-1 analog switch.
- TCXO buffer.
- SIM card I/F
- I²C compatible Interface.
- I²C device address changeable by ADRS pin.
(Device address is “1001011”,”1001100”) - Small and thin CSP package
(3.8mm × 3.8mm height 0.57mm max)
