신규 설계 비추천

BR24L08NUX-W

I²C BUS 8kbit (1024x8bit) EEPROM

Data Sheet

BR24L08NUX-W

신규 설계 비추천 BR24L08NUX-W
I²C BUS 8kbit (1024x8bit) EEPROM

기존 고객을 서포트하기 위해 생산하는 제품입니다. 신규 설계용으로는 판매하지 않습니다.

Data Sheet

Part Number	BR24L08NUX-W	BR24G08NUX-5
Ordering Part Number	BR24L08NUX-WTR	BR24G08NUX-5TR
Similar Level	-	Same Pinout, Package
Data Sheet
Supply Status	Not Recommended for New Designs	Recommended
Package	VSON008X2030	VSON008X2030
Unit Quantity	4000	4000
Minimum Packing Quantity	4000	4000
Packing Type	Taping	Taping
RoHS	Yes	Yes
Series	BR24L-W	BR24G-5
I/F	I2C BUS(2-Wire)	I2C BUS(2-Wire)
Density [bit]	8K	8K
Vcc (Min.) [V]	1.8	1.6
Vcc (Max.) [V]	5.5	5.5
Temperature (Min.)[°C]	-40	-40
Temperature (Max.)[°C]	85	85
Package Size [mm]	2.0x3.0 (t=0.6)	2.0x3.0 (t=0.6)
Input Frequency (Max.)[Hz]	400k	1M
Write Cycle (Max.)[ms]	5.0	3.5
Bit Format [Word x Bit]	1K x 8	2K x 8
Circuit Current (Max.)[mA]	2.0	1.0
Standby Current (Max.)[µA]	2.0	2.5
Endurance (Max.)[Cycle]	10⁶	4x10⁶
Data Retention (Max.)[Year]	40	200

Part Number	BR24L08NUX-W	BR24G08NUX-5
Ordering Part Number	BR24L08NUX-WTR	BR24G08NUX-5TR
Similar Level	-	Same Pinout, Package
Data Sheet
Supply Status	Not Recommended for New Designs	Recommended
Package	VSON008X2030	VSON008X2030
Unit Quantity	4000	4000
Minimum Packing Quantity	4000	4000
Packing Type	Taping	Taping
RoHS	Yes	Yes
Series	BR24L-W	BR24G-5
I/F	I2C BUS(2-Wire)	I2C BUS(2-Wire)
Density [bit]	8K	8K
Vcc (Min.) [V]	1.8	1.6
Vcc (Max.) [V]	5.5	5.5
Temperature (Min.)[°C]	-40	-40
Temperature (Max.)[°C]	85	85
Package Size [mm]	2.0x3.0 (t=0.6)	2.0x3.0 (t=0.6)
Input Frequency (Max.)[Hz]	400k	1M
Write Cycle (Max.)[ms]	5.0	3.5
Bit Format [Word x Bit]	1K x 8	2K x 8
Circuit Current (Max.)[mA]	2.0	1.0
Standby Current (Max.)[µA]	2.0	2.5
Endurance (Max.)[Cycle]	10⁶	4x10⁶
Data Retention (Max.)[Year]	40	200

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Type	Title	Last Updated
Data Sheet	BR24L08NUX-W Data Sheet	2012/08/20

Title	Description
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Type	Title	Last Updated
Technical Article	Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)	2025/04/16
White Paper	Five Steps for Successful Thermal Design of IC	2024/09/13
Thermal Design	Solder Joint Rate and Thermal Resistance of Exposed Pad	2024/07/05
Thermal Design	열저항, 열특성 파라미터에 대하여	2024/03/19
Thermal Design	Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package	2022/07/08
Thermal Design	Design Guide and Example of Stencil for Exposed Pad	2021/11/19
Thermal Design	Basics of Thermal Resistance and Heat Dissipation	2021/08/18
Thermal Design	What Is Thermal Design	2021/06/24
Thermal Design	Method for Calculating Junction Temperature from Transient Thermal Resistance Data	2021/06/14
Schematic Design & Verification	Address and Page Configuration of I²C BUS EEPROM	2020/12/23
Schematic Design & Verification	바이패스 콘덴서의 임피던스 특성	2020/09/29

Type	Title	Last Updated
No data available in table

Type	Title	Last Updated
2D/3D/CAD	VSON008X2030 Footprint / Symbol	2020/12/24

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Type	Title	Last Updated
Package Information	Anti-Whisker formation	2016/10/11
Environmental Data	Compliance with the ELV directive	2016/10/11
Environmental Data	UL94 Flame Classifications of Mold Compound	2016/10/11
Manufacturing Data	Factory Information	2016/09/30