신규 설계 비추천 RB238T100
쇼트키 배리어 다이오드

기존 고객을 서포트하기 위해 생산하는 제품입니다. 신규 설계용으로는 판매하지 않습니다.

Product Detail

 

RB238T100 대체품

Part Number
RB238T100
RB238T100
RB238T100NZ
RB238T100NZ
Ordering Part Number RB238T100 RB238T100NZC9
Similar Level - Same Pinout, Package
Data Sheet    
Supply Status Not Recommended for New Designs Recommended
Package TO-220FN (3PIN) TO-220FN (3PIN)
Unit Quantity 500 1000
Minimum Packing Quantity - 1000
Packing Type Bulk Tube
RoHS Yes Yes
Package Code ITO-220AB ITO-220AB
Grade Standard Standard
Configuration - C-Common
Number of terminal 3 3
VRM [V] 110 110
Reverse Voltage VR [V] 100 100
Average Rectified Forward Current IO [A] 40.0 40.0
IFSM [A] 100.0 100.0
Forward Voltage VF (Max.)[V] 0.86 0.86
IF @ Forward Voltage [A] 20.0 20.0
Reverse Current IR (Max.)[mA] 0.02 0.02
VR @ Reverse Current[V] 100 100
Storage Temperature (Min.)[°C] -55 -55
Storage Temperature (Max.)[°C] 150 150
Mounting Style Leaded type Leaded type
Package Size [mm] 10.0x15.0 (t=4.5) 10.0x15.0 (t=4.5)

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • 파워 측정 시, 프로브 교정의 중요성 : Deskew 편
  • 바이패스 콘덴서의 임피던스 특성

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • 열 저항 RthJC 의 측정 방법과 사용법
  • 열전대를 통한 패키지 이면 온도 측정 시의 주의점

Tools

Models

  • RB238T100 SPICE Simulation Evaluation Circuit
  • RB238T100 SPICE Model
  • RB238T100 Thermal Model (lib)

Packaging & Quality

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Anti-Whisker formation
  • Condition of Soldering

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations