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Compact, Lightweight, Room-temperature, Antenna-Integrated Terahertz Oscillators and DetectorsTerahertz Resonant Tunneling Diodes

Features

  • Compact, lightweight oscillators and highly sensitive detectors using a resonant tunneling diode (RTD)
  • High speed switching
    (Operable for over 25Gbps direct modulation and detection)

RTD Oscillators / Detectors

Applications

  • Non- destructive inspection (i.e. internal materials, moisture, metals)
  • Security systems
  • Medical, Bio Sensor
  • Ultra-high-speed wireless communication

Applications

Size comparison with an existence THz source

Size comparison with an existence THz source

Broadband operation and sensitive detection

Broadband operation and sensitive detection

Selectable Permeability Enables Internal Inspection

Selectable Permeability Enables Internal Inspection

Ultra-High Speed Wireless Communication

Ultra-High Speed Wireless Communication

The technology satisfying the competing operation of ultra-short pulse and high power LD Module for LiDAR

Features

  • Ultra-short pulse (<5ns) operation compatible with high laser power (100W to 200W)
  • Surface mounting resin-mold package
  • LD, FET, and capacitors integrated in a compact package

Applications

  • Autonomous driving
  • Range finding
  • Industrial robots

Low-inductance design is the key for ultra short pulse high-power laser

Low-inductance design is the key for ultra short pulse high-power laser

Development Roadmap

Development Roadmap

Typical characteristics of the LD module

Typical characteristics of the LD module

Circuit Diagram and Appearance

Circuit Diagram and Appearance

Compact Limiting Current Type Oxygen / Humidity SensorMiniaturized Oxygen and Humidity Sensor

Features

  • Controls the gas flow rate utilizing a porous oxide thin film
  • Utilizes an ultra-high temperature micro hot plate which exhibits long term reliability
  • High durability, low power consumption

Applications

  • In-vehicle humidity management
  • Measurement of the humidity of air flowing into internal combustion engines

Sensor Structure

Sensor Structure

Specifications (Targets)

Specifications (Targets)

Current Generation Process

Current Generation Process

Sensing Characteristics

Sensing Characteristics

MEMS Actuators and TransducersMEMS Devices Utilizing Thin-Film Piezo Technology

Research areas

  • Conducted studies on high efficiency piezoelectric thin films
  • Carried out R&D on electronic devices utilizing thin-film piezo technology
  • Analyzed the operation and failure modes of piezo devices and implemented research into high reliability prediction technology based on the Finite Element Method (FEM)
Piezoelectric Acoustic Sensor Loud Speaker and

Piezoelectric Thin-Film Reliability Technology

Piezoelectric Thin-Film Reliability Technology

Reliability Design For Electronic PackagesDeformation Behavior Analysis of Electronic Materials and Packages

Research areas

  • Mate rials : Sintered silver, Solder, Resin
  • Materials characterization : Film Tensile test, Stress-Strain curve, Thermal deformation, Finite Element Method

Research Example1 : Mechanical Behaviors of Sintered Porous Silver films

Research Example1 : Mechanical Behaviors of Sintered Porous Silver films

Research Example2 : For Designing Reliable Packages

Research Example2 : For Designing Reliable Packages

Presented papers

Simulation Environment Development for Power Devices and ModulesAccurate Prediction of How Power System Works

Research areas

  • Device Modeling, Circuit Simulation, Double Pulse Test, Power Module
  • Electro-thermal Co-simulation

Power System Simulation

Device Modeling and Power Module Modeling

Device Modeling and Power Module Modeling

Electro-thermal Co-simulation

Electro-thermal Co-simulation

Presented papers

“Ultra Small*, Cool Well”Transfer Molded SiC Power Module

*August, 2018 ROHM survey

Features

  • The industry’s lowest*1 thermal resistance*2
  • Ultra-compact, lightweight
  • High power density : 15kW/cm3

*1 : August, 2018 ROHM survey
*2 : With the same chip size, board size, and cooling capacity

Applications

  • Automotive high-power DC/DC converters
  • Main drive inverters in vehicles

Appearance

Appearance

Thermal Resistance (Rthj-w)

Thermal Resistance (Rthj-w)

Max. Junction Temperature Comparison

Max. Junction Temperature Comparison

SiC Modules Contribute to Wireless Power Supply for In-Wheel Motors While DrivingEnabling Direct Wireless Charging While Driving Significantly Extends EV Travel Range (to Nearly Infinity in Theory)

SiC Modules

Joint development with the Fujimoto Laboratory at Tokyo University and several other companies

SiC Application Demonstration3-Phase 50kW Bidirectional Inverter Utilizing SiC Devices

Power Assist Technology

Features

  • Demonstration of a 3-phase bidirectional inverter that delivers over 99% (Max) efficiency
  • Achieves 50kW output utilizing discrete devices
  • Achieves 1.8x the output power of the previous 30kW inverter demo

Applications

  • Grid-connected energy storage systems
  • Uninterruptible power systems
  • Power circulating load equipment

Overview

Overview

SiC Devices

SiC Devices

Circuit Configuration

Circuit Configuration

Characteristics

Characteristics

Performance

Performance

2MHz/120W DC/DC Converter Using GaN-FET2MHz/120W DC/DC Converter

Features

  • Small size
  • Large power density

Applications

  • Base station power systems
  • Server power systems

Circuit Configuration

Circuit Configuration

Specification

Specification

Power Conversion Efficiency Comparison

Power Conversion Efficiency Comparison

Power Density

Power Density