Microwire BUS 8Kbit (512x16bit) EEPROM - BR93G76FVT-3A

BR93G76-3A는 시리얼 3선식 인터페이스 방식의 시리얼 EEPROM입니다.
데이터 bit 형식은 16bit 고정이며, 1PIN이 CS PIN이 되는 표준적인 PIN 배치를 채용하고 있습니다.

* 본 제품은 STANDARD GRADE 제품입니다. 이 제품은 차재 기기의 사용을 권장하지 않습니다.
포장 수량
최소 포장 단위
포장 사양
BR93G76FVT-3AGE2 공급중 TSSOP-B8 3000 3000 Taping Yes
사양 :
Grade Standard
I/F MicroWire BUS(3-Wire)
Density [bit] 8K
Bit Format [Word x Bit] 512 x 16
Package TSSOP-B8
Operating Temperature (Min.)[°C] -40
Operating Temperature (Max.)[°C] 85
Vcc(Min.)[V] 1.7
Vcc(Max.)[V] 5.5
Circuit Current (Max.)[mA] 3.0
Standby Current (Max.)[μA] 2.0
Write Cycle (Max.)[ms] 5.0
Input Frequency (Max.)[Hz] 3M
Endurance (Max.)[Cycle] 106
Data Retention (Max.)[Year] 40
Comment Cu wire bonding.
특징 :
  • ・ 3-line communications of chip select, serial clock, serial data input / output (the case where input and output are shared)
    ・ Operations available at high speed 3MHz clock (4.5 V~5.5 V)
    ・ High speed write available (write time 5ms max.)
    ・ Same package and pin configuration from 1Kbit to 16Kbit
    ・ 1.7~5.5V single power source operation
    ・ Address auto increment function at read operation
    ・ Write mistake prevention function » Write prohibition at power on » Write prohibition by command code » Write mistake prevention function at low voltage
    ・ Self-timed programming cycle
    ・ Program condition display by READY / BUSY
    ・ Compact package SOP8/SOP-J8/SSOP-B8/TSSOP-B8/MSOP8/ TSSOP-B8J/DIP-T8/VSON008X2030
    ・ More than 40 years data retention
    ・ More than 1 million write cycles
    ・ Initial delivery state all addresses FFFFh
관련 상품
관련 신제품 / 갱신 제품메모리
형명 제품 이름 패키지 Datasheet 유통 재고
BR93G76-3A Microwire BUS 8Kbit (512x16bit) EEPROM DIP-T8   구입
BR93G76F-3A Microwire BUS 8Kbit (512x16bit) EEPROM SOP8   구입
BR93G76FJ-3A Microwire BUS 8Kbit (512x16bit) EEPROM SOP-J8   구입
BR93G76FV-3A Microwire BUS 8Kbit (512x16bit) EEPROM SSOP-B8   구입
BR93G76FVJ-3A Microwire BUS 8Kbit (512x16bit) EEPROM TSSOP-B8J   구입
BR93G76FVM-3A Microwire BUS 8Kbit (512x16bit) EEPROM MSOP8   구입
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기술 정보
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.