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Microwire BUS 8Kbit (512x16bit) EEPROM - BR93G76FVT-3A BR93G76-3A는 시리얼 3선식 인터페이스 방식의 시리얼 EEPROM입니다.
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* 본 제품은 STANDARD GRADE 제품입니다. 이 제품은 차재 기기의 사용을 권장하지 않습니다. |
사양 :
Grade | Standard |
I/F | MicroWire BUS(3-Wire) |
Density [bit] | 8K |
Bit Format [Word x Bit] | 512 x 16 |
Package | TSSOP-B8 |
Operating Temperature (Min.)[°C] | -40 |
Operating Temperature (Max.)[°C] | 85 |
Vcc(Min.)[V] | 1.7 |
Vcc(Max.)[V] | 5.5 |
Circuit Current (Max.)[mA] | 3.0 |
Standby Current (Max.)[μA] | 2.0 |
Write Cycle (Max.)[ms] | 5.0 |
Input Frequency (Max.)[Hz] | 3M |
Endurance (Max.)[Cycle] | 106 |
Data Retention (Max.)[Year] | 40 |
Comment | Cu wire bonding. |
특징 :
- ・ 3-line communications of chip select, serial clock, serial data input / output (the case where input and output are shared)
・ Operations available at high speed 3MHz clock (4.5 V~5.5 V)
・ High speed write available (write time 5ms max.)
・ Same package and pin configuration from 1Kbit to 16Kbit
・ 1.7~5.5V single power source operation
・ Address auto increment function at read operation
・ Write mistake prevention function » Write prohibition at power on » Write prohibition by command code » Write mistake prevention function at low voltage
・ Self-timed programming cycle
・ Program condition display by READY / BUSY
・ Compact package SOP8/SOP-J8/SSOP-B8/TSSOP-B8/MSOP8/ TSSOP-B8J/DIP-T8/VSON008X2030
・ More than 40 years data retention
・ More than 1 million write cycles
・ Initial delivery state all addresses FFFFh
어플리케이션 :
관련 상품
관련 신제품 / 갱신 제품메모리
형명 | 제품 이름 | 패키지 | Datasheet | 유통 재고 |
---|---|---|---|---|
BR93G76-3A | Microwire BUS 8Kbit (512x16bit) EEPROM | DIP-T8 | 구입 | |
BR93G76F-3A | Microwire BUS 8Kbit (512x16bit) EEPROM | SOP8 | 구입 | |
BR93G76FJ-3A | Microwire BUS 8Kbit (512x16bit) EEPROM | SOP-J8 | 구입 | |
BR93G76FV-3A | Microwire BUS 8Kbit (512x16bit) EEPROM | SSOP-B8 | 구입 | |
BR93G76FVJ-3A | Microwire BUS 8Kbit (512x16bit) EEPROM | TSSOP-B8J | 구입 | |
BR93G76FVM-3A | Microwire BUS 8Kbit (512x16bit) EEPROM | MSOP8 | 구입 |
New Products:
기술 정보
Thermal Resistance
The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.
Part Explanation
For ICs