125℃ 동작 SPI BUS EEPROM - BR25H128F-2AC

BR25H128F-2AC는 SPI BUS 인터페이스의 128Kbit 시리얼 EEPROM입니다.

포장 수량
최소 포장 단위
포장 사양
BR25H128F-2ACE2 공급중 SOP8 2500 2500 Taping Yes
사양 :
Grade Automotive
Density [bit] 128K
Bit Format [Word x Bit] 16K x 8
Package SOP8
Operating Temperature (Min.)[°C] -40
Operating Temperature (Max.)[°C] 125
Vcc(Min.)[V] 2.5
Vcc(Max.)[V] 5.5
Circuit Current (Max.)[mA] 5.5
Standby Current (Max.)[μA] 10.0
Write Cycle (Max.)[ms] 4.0
Input Frequency (Max.)[Hz] 10M
Endurance (Max.)[Cycle] 106
Data Retention (Max.)[Year] 100
특징 :
    • SPI BUS interface (CPOL, CPHA)=(0,0), (1,1)
    • Voltage Range: 2.5V to 5.5V
    • Operating Range: -40°C to +125°C
    • Clock Frequency: 10MHz(Max)
    • Write Time: 4ms(Max)
    • Page Size: 64bytes
    • Bit Format: 16384 x 8bit
    • 64bytes Write Lockable Identification Page (ID Page)
    • Address Auto Increment Function at Read Operation
    • Auto Erase and Auto End Function at Data Rewrite
    • Write Protect Block Setting by Software Memory Array 1/4, 1/2, Whole
    • HOLD Function by HOLDB Pin
    • Low Supply Current
      Write Operation (5V): 1.0mA (Typ)
      Read Operation (5V): 1.2mA (Typ)
      Standby State (5V): 0.1µA (Typ)
    • Prevention of Write Mistake
      Write prohibition at Power On
      Write prohibition by WPB Pin
      Write prohibition Block Setting
      Prevention of Write Mistake at Low Voltage
    • Write Cycles
      : 1,000,000 Write Cycles (Ta≤85°C)
      : 500,000 Write Cycles (Ta≤105°C)
      : 300,000 Write Cycles (Ta≤125°C)
    • Data Retention
      : 100 Years (Ta≤25°C)
      : 60 Years (Ta≤105°C)
      : 50 Years (Ta≤125°C)
    • Data at Shipment
      Memory Array: FFh
      ID Page First 3 Addresses: 2Fh, 00h, 0Eh
      Other Addresses: FFh
      Status Register WPEN, BP1, BP0: 0, 0, 0
      Lock Status LS: 0
    • TSSOP-B8, SOP8, SOP-J8 Packages
    • AEC-Q100 Qualified
관련 상품
관련 신제품 / 갱신 제품메모리
형명 제품 이름 패키지 Datasheet 유통 재고
BR25H128FVT-2AC 125℃ 동작 SPI BUS EEPROM TSSOP-B8   구입
BR25H128FJ-2AC 125℃ 동작 SPI BUS EEPROM SOP-J8   구입
New Products:
기술 정보
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.