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SPI BUS EEPROM - BR25G128F-3

BR25G128F-3은 128Kbit SPI BUS 인터페이스 시리얼 EEPROM입니다.

Additional Information  
FAQ 
구입 
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* 본 제품은 STANDARD GRADE 제품입니다. 이 제품은 차재 기기의 사용을 권장하지 않습니다.
형명
상태
패키지
포장 수량
최소 포장 단위
포장 사양
RoHS
BR25G128F-3GE2 공급중 SOP8 2500 2500 Taping Yes
 
사양 :
Grade Standard
I/F SPI BUS
Density [bit] 128K
Bit Format [Word x Bit] 16K x 8
Package SOP8
Operating Temperature (Min.)[°C] -40
Operating Temperature (Max.)[°C] 85
Vcc(Min.)[V] 1.6
Vcc(Max.)[V] 5.5
Circuit Current (Max.)[mA] 8.0
Standby Current (Max.)[μA] 2.0
Write Cycle (Max.)[ms] 5.0
Input Frequency (Max.)[Hz] 20M
Endurance (Max.)[Cycle] 106
Data Retention (Max.)[Year] 100
more
특징 :
  • · High Speed Clock Action up to 20MHz (Max)
    · Wait Function by HOLDB Terminal
    · Part or Whole of Memory Arrays Settable as Read only Memory Area by Program
    · 1.6V to 5.5V Single Power Source Operation Most Suitable for Battery Use.
    · Up to 64 Bytes in Page Write Mode.
    · For SPI Bus Interface (CPOL, CPHA) = (0, 0), (1, 1)
    · Self-timed Programming Cycle
    · Low Current Consumption
      ·At Write Action (5V) : 0.5mA (Typ)
      ·At Read Action (5V) : 2.0mA (Typ)
      ·At Standby Action (5V) : 0.1µA (Typ)
    · Address Auto Increment Function at Read Action
    · Prevention of Write Mistake
      ·Write Prohibition at Power On
      ·Write Prohibition by Command Code (WRDI)
      ·Write Prohibition by WPB Pin
      ·Write Prohibition Block Setting by Status Registers (BP1, BP0)
      ·Prevention of Write Mistake at Low Voltage
    · More than 100 years Data Retention.
    · More than 1 Million Write Cycles.
    · Bit Format 16K×8
    · Initial Delivery Data
      ·Memory Array: FFh
      ·Status Register: WPEN, BP1, BP0 : 0
more
 
 
관련 상품
관련 신제품 / 갱신 제품메모리
형명 제품 이름 패키지 Datasheet 유통 재고
BR25G256F-3 SPI BUS EEPROM SOP8   구입
BR25G256FJ-3 SPI BUS EEPROM SOP-J8   구입
BR25G256FVT-3 SPI BUS EEPROM TSSOP-B8   구입
BR25G128FJ-3 SPI BUS EEPROM SOP-J8   문의
BR25G128FVT-3 SPI BUS EEPROM TSSOP-B8   문의
BR25G128FVM-3 SPI BUS EEPROM MSOP8   문의
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기술 정보
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.

Part Explanation

For ICs