Automotive Panel Power Management IC - BM81810MUV-M

BM81810MUV-M is a power management IC for TFT-LCD panels which are used in car navigation, in-vehicle center panel, and instrument cluster. This IC incorporates VCOM amplifier, Gate Pulse Modulation (GPM) in addition to the power supply for panel driver (SOURCE, GATE, and LOGIC power supplies). Moreover, this IC has a built-in EEPROM for sequence and output voltage setting retention.

포장 수량
최소 포장 단위
포장 사양
BM81810MUV-ME2 공급중 VQFN32SV5050 2500 2500 Taping Yes
사양 :
Grade Automotive
ch 5
Vin1(Min.)[V] 2.6
Vin1(Max.)[V] 5.5
SW frequency(Max.)[MHz] 2.1
Circuit Current(Typ.)[mA] 2.0
Start up Sequence Circuit Yes
VCOM[ch] 1
Serial I/F I2C
Operating Temperature (Min.)[°C] -40
Operating Temperature (Max.)[°C] 105
특징 :
    • AEC-Q100 Qualified
    • Alternative Synchronous Buck DC/DC converter or LDO for VDD output
    • Synchronous Boost DC/DC converter for AVDD output with integrated load switch.
    • VCOM amplifier with 7bit calibrator
    • Positive charge pump (Integrated diode, x2/x3) for VGH output
    • Negative charge pump for VGL output
    • VGH and VCOM temperature compensation
    • Gate Pulse Modulation (GPM)
    • I²C Interface Output Voltage Setting Control Function
      (Integrated EEPROM)
    • Switching frequency switching function
      (525KHz, 1.05MHz, 2.1MHz)
    • Protection circuits
      • Under-Voltage Lockout
      • Thermal Shut Down
      • Over-Current Protection
      • Over-Voltage Protection
      • Under Voltage Protection (Timer Latch type)
    • Input tolerant (SCL, SDA, EN, WPN)
관련 상품
관련 신제품 / 갱신 제품파워 매니지먼트
형명 제품 이름 패키지 Datasheet 유통 재고
BD81870EFV-M Step-up / Inverted 2ch Switching Regulator HTSSOP-B20   구입
BD81842MUV-M 오토모티브 판넬용 시스템 전원 IC VQFN24SV4040   구입
BM81110MUW 12V 입력 다채널 시스템 전원 IC VQFN40W6060A   구입
BD8174MUV TFT-LCD 판넬용 출력전압 고정 다채널 시스템 전원 VQFN048V7070   문의
BM81004MUV 12V 입력 다채널 시스템 전원 IC VQFN48V7070A   구입
BD83854MUV TFT-LCD 디스플레이 전원용 승압 / 반전 스위칭 레귤레이터 VQFN20PV3535   구입
New Products:
기술 정보
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.